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Our Direct-Write (DW) ultrasonic transducer array, consisting of seven elements, was fabricated onto an aluminum-alloy test block to provide thickness monitoring. Each direct-write ultrasonic transducer conducts active mode pulse-echo ultrasonic testing, generating and detecting bulk waves sequentially.
When a bulk wave reflects off the backwall of the structure, the time taken for reflection reveals any changes in thickness directly beneath the direct-write ultrasonic transducer. A decrease in reflection time indicates a reduction in thickness, enabling thickness monitoring.
This low-profile array can be seamlessly integrated onto the host structure and covered by a paint layer, remaining virtually invisible without compromising aesthetics. It blends with the structure, appearing as though no ultrasonic transducer is present on the surface.
Ultrasonic SHM System
Ultrasonic SHM System
A compact ultrasonic SHM system can be integrated with the direct write ultrasonic transducer array, offering customization options for user-specified connectors. The system wirelessly transmits ultrasonic signals to a computer for post-processing and analysis.
Software Interface
Software Interface
The user-friendly, interactive dashboard allows for real-time analysis, monitoring thickness changes, and ensuring ongoing structural health.
Performance of the current setup
Operates at 6.67 MHz
Minimum wall thickness: 2.5 mm
Thickness resolution: 0.01 mm
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